OSNABRUCK, GERMANY — Following a six-year hiatus, Diosna will mark its return to interpack 2023 with technology solutions for several segments of the food industry, including fermentation, granulation and mixing. The international trade show is set for May 4-10 in Dusseldorf, Germany.
At the Diosna Booth #C23 in Hall 4, show attendees can view the WH240 A Wendel Mixer, which can handle various types of dough, masses and bars. Designed with hygienically optimized stainless steel profiles and an open construction, the mixer is easy to clean with short downtimes.
Also on display will be the Universal Mixer V100, which combines mixing technology with an array of applications in the food industry. The mixer delivers quality results in a short process time for solid mixtures.
Diosna will also demonstrate how its automated AGV systems work with its equipment to promote safe processes and systems.
