HERNDON, VA — The PMMI Foundation, the charitable arm of PMMI, the association for packaging and processing technologies, announced the recipients of the 2024 Pack Expo scholarships.
This year, six students from North American colleges and universities have been awarded a $5,000 scholarship to support their academic pursuits and career development in the packaging and processing industries.
The scholarships, supported by Pack Gives Back events at Pack Expo International and Pack Expo Las Vegas, showcase PMMI’s commitment to investing in the future of the industry and its upcoming workforce.
“Supporting the next generation of industry leaders is central to our mission,” said Jim Pittas, president and CEO of PMMI. “Thanks to the incredible support of our sponsors and partners, we can continue to provide resources that inspire innovation and growth in the packaging and processing sectors. We extend our gratitude to everyone who contributes to this initiative.”
Each year, the PMMI Foundation awards over $200,000 in scholarships to students pursuing degrees in fields including packaging, food processing, engineering and mechatronics. Since its formation, the Foundation has awarded over $3.8 million to support the future workforce.
To be eligible for the $5,000 scholarship, students must demonstrate academic excellence, a strong commitment to advancing the industry and a major in a related field.
The 2024 Pack Expo Scholarship recipients include:
- Morgan Bartholomew, Pennsylvania College of Technology, Polymer & Plastics Engineering
- Amy Foo, California Polytechnic State University, San Luis Obispo, Industrial Technology and Packaging
- Matthias Fowler, Hennepin Technical College, Mechatronics
- Madison Roberts, Michigan State University, Packaging Science
- Ethan Sawyer, Tennessee Technological University, Mechanical Engineering
- Blake Strickland, Cape Fear Community College, Industrial Engineering Technology
For more information about the PMMI Foundation and its scholarship programs, visit the association’s website.